IR AOI SYSTEM

SSVT WST-6000 High Speed IR Wafer Inspection System

SSVT SKYEYES IR WST Series
Features
High-precision inspection: 2D inspection accuracy up to 3.5 μm; SWIR inspection accuracy up to 5 μm for hidden crack detection.
High throughput: Over 30 wafers/hour for 2D inspection, and up to 4 wafers/hour for full-field SWIR scanning.
AI-powered algorithms: Combines traditional AOI with AI mode to enhance defect recognition and classification.
Patented optical technology: Proprietary high-luminance lighting and patented SWIR imaging improve clarity and reduce noise.
Dual-side inspection: Supports simultaneous front and backside inspection with anti-static design for wafer protection.
Modular software: User-friendly interface with multi-level access control and automated reporting.
Low maintenance cost: Consumable-free design with minimal maintenance requirements for stable mass production.

Description

The SSVT WST-6000 High-Speed Infrared Wafer Inspection System (Skyeyes Series) is designed for high-precision defect inspection in semiconductor wafer processes. Supporting 6", 8", and 12" wafers, it enables both frontside and backside inspection. Equipped with patented SWIR infrared technology, it effectively detects hidden cracks and backside defects. With AI-driven algorithms and a high-precision motion stage, the WST-6000 delivers both high throughput and outstanding inspection accuracy.

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Specification
WST6000 Items Descriptions Remark
Machines Mechanism parameters
      1.Size: W2200mm×D2580mm×H2100mm
2. Weight: EFEM+ Flipper ≤ 900kg, Stage≤ 1350kg
3. XY Motion Repeatability: ±0.4um
4. XY range: >520mm X 500mm
  
Power & Electricity         5. Power consumption: 5KW
        6. Single Phase AC220V±10% 3KVA
        7. Vacuum: ≤-80kPa, 50L/min
        8. Air source: 0.45~0.65MPa, 20L/min
        9. Cleanliness: Class 10 (FFU use)
      10. Temperature and humidity: 22°C±5°C; Humidity range: 50%±10% RH		  
System & Ability 2D front-facing inspection optical configuration
  • 2D objective configuration 2x 3.5x 5x 10x
  • CCD Pixel Resolution 2.75um(2X),  1.57um(3.5X) , 1.1um(5X), 0.55um(10X)
  • Coaxial brightfield ,dark field(Optional)
  • 1200W Area array camera, 2500W Color area array
  
Regular defects Scratches, dust, dirt, damage, stitch position shift, stitch marks are too large, PAD  broken, and other appearance defects, cracks  
Dicing Street defects Edges crack, not cut through, broken, dicing shift , Chipping  
WPH （Front 2D ） 12”wafer >31   8”wafer >53    6”wafer >72 Scanning time
WPH（Backside SWIR） 12 inches : 4 pieces, 8 inches: 8 pieces ,6 inches: 13 pieces     （10mm x 10mm Size) Full field of view utilization
Software capabilities SPC functions - capacity maps, histograms, and production analysis (online and offline functions) at the single chip level, positive wafer level, and whole batch material level; chip editing software (online and offline functions) data offline loading, review, reclassification of results and other functional equipment calibration and debugging functions;  
Others Double wishbone Compatible material: 12"framed wafer Repeatability: ±0.1mm,
Finger Material: Aviation Aluminum 7075, Piece Picking Method: Cylinder Pressing		    
Aligner Ring position accuracy: ±0.2mm, angle accuracy: ±0.2°  
Stage Axis position: X, Y, z, zp, θ; Vibration isolation:  
Cassette 12” framed wafer Open cassette/ Customer designed FOUP  
Computer configuration 64 cores, more than 256G memory, more than 16T hard disk  


 
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