PRODUCTS
- Home
- Products
- IR AOI SYSTEM
- Fully Auto Cow/Cop IR inspection Machine PDI-3030
IR AOI SYSTEM
Fully Auto Cow/Cop IR inspection Machine PDI-3030
SSVT Cow/Cop IR Inspection PDI-3000 Series- Features
- Suitable for AB1 (Chip on Wafer) and AB2 (Chip on Panel) post-die-bonded inspection
- High-precision infrared CCD
- High-precision inspection: 1μm × 1μm inspection accuracy and 0.5μm metrology accuracy.
- Comprehensive defect coverage: Detects die chipping, hided crack, scratches, contamination, component shift, and rotation errors.
- Automation: Full cassette loading/unloading, barcode scanning, and automatic report generation.
- AI + traditional algorithms: Fast and accurate defect recognition.
- Optional IR module: Enables detection of internal micro-cracks and backside edge defects.
- Production compatibility: Automatic Wafer FOUP and Panel Cassette ability, quick recipe switching.
- Optional marking module: Laser or ink-dot marking for defective products.
Description
The SSVT PDI-3000 Series IR AOI System is designed for advanced packaging CoWoS, CoPoS processes, providing high-precision inspection of die appearance, positioning, and hiden defects. With inspection accuracy of 1μm × 1μm and metrology accuracy of 0.5μm, it effectively detects die chipping, scratches, contamination, cracks, and positional deviations. The system supports full cassette auto-loading/unloading, barcode scanning, and integrates both AI and traditional algorithms for fast and accurate defect identification. Optional IR inspection and laser marking modules further enhance yield management and production efficiency.Specifications
| Items | Descriptions |
| Product Type | Component position, die chipping, die scratches, die contamination, die cracks, die position metrology, die rotation metrology |
| Inspection Items | Scratches, foreign objects, damage, chipping |
| Inspection Accuracy | 1μm × 1μm |
| Metrology Accuracy | 0.5μm |
| Applications |
|
| Key Features | - Automatic mapping & production reports - Optional IR inspection - Laser/marking options for defective products - AI + traditional algorithms |