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- Reel to Reel IR AUX-1313FA
IR AOI SYSTEM
Reel to Reel IR AUX-1313FA
SSVT RTR-AUX-1313 Series- Features
- Wide inspection range: Supports 8mm–24mm carrier tape width (customizable).
- Dual vision systems: Combines FVI (visible light) and SWIR infrared inspection for hidden crack detection.
- High throughput: Up to 50K–60K chips/hour depending on die size.
- Full automation: Auto wheel change, auto threading, reverse winding, and NG tape labeling.
- Cover tape inspection: Detects sealing and surface defects.
- Data statistics: Chip counting, NG chip classification, and optional manual review.
- Compact design: Small footprint, ideal for mass production integration.
Description
The SSVT RTR-AUX1313FA IR Fully Automatic Reel-to-Reel Inspection System is designed for high-speed and high-precision inspection of carrier tapes, chips, and package surfaces in semiconductor assembly processes. Combining both visible light and short-wave infrared (SWIR) vision systems, it effectively detects hidden cracks, package damages, and sealing defects. With features such as auto-wheel change, auto threading, reverse winding, and NG tape auto-labeling, this compact system ensures high throughput, reliable inspection results, and reduced manual intervention.FVI Vision Specifications
SWIR Vision Specifications
| Item | FVI Vision Specification | ||||||||||
| Package Type |
WLCSP (No BSC Type)
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| Pocket Depth |
2mm
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| Types |
Carrier Sealing
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Mark | Bare Die | ||||||||
| Inspection Items | Broken | Width | Uneven | Pinhole | Direction | Missed | Direction | Broken | Contaminated | Crack | Dust |
| FOV (mm x mm) | 17mm x 15mm | N/A | 4.2mm x 3.5mm – 8.4mm x 7.1mm | ||||||||
| Resolution | 8μm | N/A | 1.7μm–3.45μm | ||||||||
| UPH(100% Good Die Base) | Chip Sizes | UPH | |||||||||
| 1mm x 1mm | 60.0K +10% | ||||||||||
| 2mm x 2mm | 60.0K +10% | ||||||||||
| 3mm x 3mm | 58.0K +10% | ||||||||||
| 4mm x 4mm | 56.0K +10% | ||||||||||
| 5mm x 5mm | 55.0K +10% | ||||||||||
| 6mm x 6mm | 54.0K +10% | ||||||||||
| 7mm x 7mm | 53.0K +10% | ||||||||||
| MTBA | > 60 mins | ||||||||||
| MTBF |
> 120 hrs
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SWIR Vision Specifications
| Item | SWIR Vision Specification | ||||||||||
| Suitibal Die Size | 0.2mm x 0.4mm – 7.0mm x 7.0mm | ||||||||||
| Inspection Items | Shadow (Delamination) | Seal Ring Damages | Hidden Crack/Chipping | Corner Chipping | |||||||
| Camera | 5MP SWIR cameras x 2 | ||||||||||
| Lighting Source | Flash IR | ||||||||||
| FOV |
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| Resolution | 1.38μm | ||||||||||
| Detectability (Min.) | 6μm x 6μm | ||||||||||
| Machine Ability & UPH | Chip Sizes | UPH | |||||||||
| 1mm x 1mm | 50.0K +10% | ||||||||||
| 2mm x 2mm | 50.0K +10% | ||||||||||
| 3mm x 3mm | 25.0K +10% | ||||||||||
| 4mm x 4mm | 12.5K +10% | ||||||||||
| 5mm x 5mm | 12.5K +10% | ||||||||||
| 6mm x 6mm | 10.0K +10% | ||||||||||
| 7mm x 7mm | 10.0K +10% | ||||||||||