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CPO Application
High-Speed Multi-Die Bonding System
HS-DB2000- Features
- Supports ≥8 types of die bonding capability
- Compatible with dispensing and dipping processes
- Low, medium, and high precision modes can operate within one program
- Dual-system parallel operation for higher productivity
- Closed-loop pressure control (10–200 g ± 2 g + 1% F.S.)
- Suitable for COB, BOX, and multi-chip stacking packages
- Optional dipping system reduces baking steps
Description
The HS-DB2000 is a fully automated system for high-speed multi-die packaging. It supports both dispensing and dipping processes with four dipping heads. The dual-system parallel design maximizes throughput, while closed-loop pressure control ensures bonding accuracy. It is ideal for COB, BOX, and other multi-chip module packaging applications.Specifications
| Bonding Method | High-speed automatic multi-die bonding |
| Bonding Process | Dispensing and dipping bonding |
| Placement Accuracy | ±5 μm |
| Pressure Control Range | 10 – 200 g ± 2 g + 1 % F.S. |
| Bonding Head System | Closed-loop pressure control |
| Bonding Modes | Low, medium, and high precision can operate in combination |
| Bonding Capability | Supports ≥ 8 types of die bonding |
| Bonding Area | 200 mm × 200 mm |
| Bonding Speed | ~0.25 s / chip (depending on application) |
| Feeding Method | Chip: Gel-pak / Wafer ring; Substrate: Tray / Tape |
| Applications | COB, BOX, multi-chip stack packages |
| Machine Dimensions | Approx. W 1500 × D 1200 × H 1600 mm |