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CPO Application
High-Precision Multi-Die Bonding System
LQ-VADB30- Features
- Suitable for COB and BOX deep-cavity multi-die bonding
- Supports multiple feeding types: blue film, waffle tray, Gel-Pak
- Automatic nozzle exchange (4 nozzles capacity)
- Placement accuracy ±1.5 μm
- Three precision alignment modes: front, back, and real-time alignment
- Dynamic temperature-error compensation for stable performance
- Supports PD, VCSEL, and COC array bonding
Description
The LQ-VADB30 is a high-precision hybrid multi-die bonding system designed for COB and BOX deep-cavity applications. It supports multiple feeding methods (blue film, waffle tray, and Gel-Pak) and achieves ±1.5 μm placement accuracy. With three alignment modes—front, back, and real-time—it meets the stringent requirements of optoelectronic, PD/VCSEL, and COC packaging.Specifications
| Bonding Method |
|
| Placement Accuracy | ±1.5 μm |
| Bonding Modes | Front, back, and real-time alignment |
| Feeding Method | Blue film, waffle tray, Gel-Pak |
| Nozzle Exchange | Automatic nozzle change (4 nozzles) |
| Stage System | High-stability linear motor platform |
| Die Size Range | 0.2 mm × 0.2 mm ～ 10 mm × 10 mm |
| Bonding Area | 150 mm × 150 mm |
| Applications | COB, BOX, PD, VCSEL, COC array bonding |
| Machine Dimensions | Approx. W 1400 × D 1200 × H 1600 mm |