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CPO Application
High-Speed Optical Module Bonder
H3 SERIES- Features
- Wide process capability: eutectic, UV curing, dipping, dispensing, pre-sintering, TCB, LAB
- High placement accuracy: ±1.5 μm (glass die)
- Pressure control: 10–200 g ± 2 g + 1% F.S. (real-time display)
- Chip size range: 0.15 mm × 0.15 mm – 15 mm × 15 mm
- 12-slot nozzle library
- Supports DA + LAB and Fluxless TCB processes
- Pulse heating technology (max ramp rate 100 °C/s)
- Ideal for silicon-photonics PIC flip-chip bonding
Description
The H3 Series is designed for high-speed optical module chip packaging. It supports various processes such as eutectic bonding, UV curing, dipping, dispensing, pre-sintering, TCB, and LAB. With ±1.5 μm placement accuracy and real-time pressure display, it handles chip sizes from 0.15 mm to 15 mm.Specification
| Supported Processes | Eutectic / UV curing / dipping / dispensing / pre-sintering / TCB / LAB |
| Placement Accuracy | ±1.5 μm （glass die） |
| Pressure Control Range |
|
| Chip Size Range | 0.15 mm × 0.15 mm ～ 15 mm × 15 mm |
| Nozzle Library | 12 slots |
| Heating Technology | Pulse heating, max ramp rate 100 °C/s |
| Temperature Control Accuracy | ±0.5 °C |
| Cooling Method | High-efficiency air cooling system |
| Applications | Silicon photonics PIC flip-chip bonding, 200 G/lane optical module packaging |
| Machine Dimensions | Approx. W 1500 × D 1300 × H 1650 mm |