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CPO Application
High-Speed Die Attach System
LQ-DA1201- Features
- High-speed, high-precision bonding with up to 12K UPH
- Supports silver epoxy bonding and DAF processes
- Compatible with lead frame and substrate feeding
- Supports 12-inch wafer frame and wafer ring
- Maximum bonding accuracy of ±10 μm
- Modular design for easy maintenance and flexibility
- Reliable temperature and pressure control system
Description
The LQ-DA1201 High-Speed Die Attach System is a high-precision, high-speed packaging solution designed for IC die-attach applications.It combines innovative advanced technology with proven process expertise, supporting silver epoxy bonding and DAF processes,
and is compatible with both lead frame (LF) and substrate feeding.
The system supports 12-inch wafer frame and wafer ring, achieving a maximum placement accuracy of ±10 μm and a throughput up to 12K UPH.
Specifications
| Bonding | Method |
|
| Process |
|
|
| Application | IC packaging / Die attach | |
| Placement Accuracy (@3σ) | ±10 μm (precision mode); ±25 μm (standard mode) | |
|
|
±1° | |
|
|
6K (precision mode); 12K (standard mode, depends on application) | |
| Die | Size | Min 0.25×0.25 mm; Max 15×15 mm |
| Thickness | 0.075–1.0 mm | |
| Substrate | Size |
|
| Thickness | Standard 0.1–0.8 mm; Optional 0.8–2.0 mm | |
| Magazine | Size | Length 110–310 mm; Height 20–110 mm; Width 70–153 mm |
| Wafer Handling System | 支援尺寸 |
|