CPO Application

Multi-Die Bonder

HS-DB3000
Features
Supports epoxy, conductive adhesive, and eutectic bonding
±3 μm placement accuracy, ±0.1 μm repeatability
12-nozzle configuration with automatic pick & place
Compatible with various die and hybrid substrate sizes
Modular structure for easy maintenance and scalability
AI vision recognition with height sensing and compensation

Description

The HS-DB3000 Multi-Die Bonder is a multifunctional high-speed die bonder designed for high-volume industrial production.
It features an adjustable dispensing system and precision placement stage,
equipped with 12 high-precision nozzle modules, supporting both PCB and hybrid substrate packaging.
With integrated image recognition, height sensing, dispensing, and bonding,
the system is ideal for optoelectronics, microelectronics, and advanced packaging automation.
Add Inquiry (0)
Specifications
Bonding System
Method
Epoxy bonding (dispensing, coating, back adhesive) for top/bottom dies
Accuracy
±3 μm (standard die); ±7 μm, 0.01° (application dependent)
Efficiency 3–5 s/piece (depending on product)
Dispensing System Method
Pressure valve (with optional time-pressure control)
Height Measurement
Contact or non-contact laser sensor
Dispensing Head
Needle-type dispenser
Bonding Area Working Range 300×200 mm; repeatability < 0.5 μm
Rotation Axis 360°; repeatability 0.01°
Feeding System Feeding System 5× 2" Gel-pak / Waffle trays
Product Supports PCB & hybrid substrates (60–200 mm) manual load/unload
Vision System Camera Ultra-high resolution industrial camera
Illumination Coaxial and adjustable RGB backlight
Machine Size Dimensions W1350×D1300×H1750 mm
Back to List
TOP